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化工儀器網>產品展廳>光學儀器及設備>電子顯微鏡>聚焦離子束顯微鏡(FIB)> Helios 5 Laser PFIB System

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Helios 5 Laser PFIB System

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  • 公司名稱 賽默飛電子顯微鏡
  • 品牌 FEI/賽默飛
  • 型號
  • 產地
  • 廠商性質 生產廠家
  • 更新時間 2024/8/28 14:12:57
  • 訪問次數 925

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FEI公司,2016年被賽默飛世爾科技收購,成為賽默飛材料與結構分析(MSD) 電鏡事業部,是顯微鏡和微量分析解決方案的創新者和供應商。 我們提供掃描電子顯微鏡SEM,透射電子顯微鏡TEM和雙束-掃描電子顯微鏡DualBeam FIB-SEM,結合先進的軟件套件,運用廣泛的樣本類型,通過將高分辨率成像與物理、元素、化學和電學分析相結合,使客戶的問題變成有效可用的數據。

掃描電子顯微鏡,雙束電鏡,透射電子顯微鏡,冷凍電鏡,X射線光電子能譜儀,三維可視化軟件

Helios 5 Laser PFIB System

FIB SEM laser tool for high throughput millimeter scale cross sectioning and 3D characterization with nanometer resolution

The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.

Key Features


Fast material removal

Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.

Accurate and repeatable cut placement

The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.

High throughput processing of challenging materials

Includes non-conductive or ion-beam-sensitive samples.

Shares all capabilities of the Helios 5 PFIB platform

High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.

Statistically relevant subsurface and 3D data analysis

Acquire data for much larger volumes within a shorter amount of time.

Fast characterization of deep subsurface features

Extraction of subsurface TEM lamella or chunks for 3D analysis.

Fast and easy characterization of air-sensitive samples

No need to transfer samples between different instruments for imaging and cross-sectioning.

Specifications

Femtosecond-laser specifications
Laser integration
  • Fully integrated in the chamber with the same coincident point for all 3 beams (SEM/PFIB/laser), enabling accurate and repeatable cut placement and 3D characterization.

Laser Output
First Harmonic
  • Wavelength

1030 nm (IR)


  • Pulse duration

<280 fs

Second Harmonic
  • Wavelength

515 nm (green)


  • Pulse duration

<300 fs

Optics
Coincident point
  • Working distance= 4 mm (Same as SEM/FIB)

Objective lens
  • Variable (motorized)

Polarization
  • Horizontal/vertical

Repetition rate
  • 1 kHz – 1 MHz

Position accuracy
  • <250 nm

Protective shutter
  • Automated SEM/PFIB protective shutter

Software
  • Laser control software

  • Laser 3D serial sectioning workflow

  • Laser 3D serial sectioning workflow with EBSD

  • Laser scripting with optional Thermo Scientific AutoScript 4 Software

Safety
  • Interlocked laser enclosure (Class 1 laser safety)




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