SD-900M磁控濺射儀鍍膜儀博遠微納SD-900M 型離子濺射儀外觀亮麗做工精致。

磁控濺射是物理氣相沉積的一種。一般的濺射法可被用于制備金屬、半導體、絕緣體等多材料，且具有設備簡單、易于控制、鍍膜面積大和附著力強等優點，磁控濺射法更是實現了高速、低溫、低損傷。因為是在低氣壓下進行高速濺射，必須有效地提高氣體的離化率。磁控濺射通過在靶陰極表面引入磁場，利用磁場對帶電粒子的約束來提高等離子體密度以增加濺射率。

配有高位定性的飛躍真空泵

 SD-900M磁控濺射儀博遠微納朗

The SD-900M ion sputtering apparatus has beautiful appearance and exquisite workmanship.

Magnetron sputtering is a kind of Physical Vapor Deposition (PVD). The general sputtering method can be used to prepare materials such as metal, semiconductor, insulator and so on. It has the advantages of simple equipment, easy control, large coating area and strong adhesion. The magnetron sputtering method has achieved high speed, low temperature and low damage. Because of the high velocity sputtering at low pressure, the ionization rate of gas must be increased effectively. Magnetron sputtering improves the plasma density by increasing the plasma density by introducing magnetic field on the cathode surface and confining the charged particles by magnetic field.

Equipped with high stability of vacuum pump